A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications. You will need a heat gun capable of reaching 750-1110 degrees F, but they’re relatively inexpensive-and if you deal with wiring regularly, the benefits of the connectors justify the cost.Production-proven Electroplating Chemistries for Wafer Level PackagingĭuPont Electronics and Industrial award-winning SOLDERON™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars. Plus, consider that they’re easier to use than a soldering iron and require little to no practice or special skills.
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